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november 2013 docid022806 rev 2 1/13 ST33TPM12I2C trusted platform module with i2c interface based on 32-bit arm? securcore? sc300? cpu features tpm features ? single-chip trusted platform module (tpm) ? compliant with trusted computing group (tcg) trusted platform module (tpm) main specifications 1.2, level 2, revision 116 ? based on tcg pc client specific tpm interface specifications 1.21 ? fully based on the common criteria (cc) eal4+ certified lpc version st33tpm12lpc ? i 2 c support in standard mode (100 khz) and fast mode (400 khz), supporting clock stretching ? provisioned with endorsement key and endorsement key certificate ? support of clock suspension for power saving mode ? support of field upgrade and dictionary attack protection ? monotonic counter endurance guaranteed for 7 years ? support of software and hardware physical presence hardware features ? arm? securcore? sc300? 32-bit risc core ? highly reliable cmos eeprom submicron technology ? 30-year data retention at 25 c ? 500,000 erase/write cycles endurance typical at 25 c ? temperature range: 0c to +70c ? esd protection up to 4 kv (hbm) ? 3.3 v supply voltage range ? 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ecopack? packages security features ? active shield and environmental sensors ? memory protection unit (mpu) ? monitoring of environmental parameters (power and clock) ? hardware and software protection against fault injection ? ais-31 class p2 compliant true random number generator (trng) ? cryptographic algorithms: ? rsa key generation from 512 to 2048 with a 2-byte step ? rsa signature and encryption ? sha-1 and sha-256 ? aes-128 in ctr mode performance and resource features ? sha1 computation for 64-byte block: 155 s (a) ? signature with a 2048-bit key: 150 ms (a) ? signature with a 1024-bit key: 30 ms (a) ? nv storage allocated space: 4 kbytes (1.2 kbytes used by ek certificate) ? supported 2048-bit key slots: ? up to 10 key slots (without ek and srk) ? 1 key slot in volatile memory for high- frequency loading use case tssop28 vqfn32 a. typical value with clock configuration in secure mode without communication time. www.st.com data brief
description ST33TPM12I2C 2/13 docid022806 rev 2 1 description the ST33TPM12I2C is a cost-effective and high performance trusted platform module (tpm) targeting embedded system applications. this device implements the functions defined by the trusted computing group (www.trustedcomputinggroup.org) in the tcg trusted platform module specifications version 1.2 level 2 revision 116 ([1][2][3]), and is also based on the tcg pc client specific tpm interface specifications 1.21 [5] and the pc client implementation specification for conventional bios [6] for what concerns the tpm internal register list and bit definitions. the ST33TPM12I2C is based on a secure mcu hardware platform. the ST33TPM12I2C is built on a 32-bit arm? reduced instruction set computing (risc) processor which provides high cryptographic and general performances. a crypto-processor nescrypt is also present to support efficiently all public key cryptographic algorithms. 1.1 hardware features the ST33TPM12I2C is based on a smartcard-class secure mcu that incorporates the most recent generation of arm processors for embedded secure systems. its securcore? sc300? 32-bit risc core is built on the cortex? m3 core with additional security features to help to protect against advanced forms of attacks. cadenced at 30 mhz, the sc300? core brings great performance and excellent code density thanks to the thumb?-2 instruction set. the ST33TPM12I2C offers a fast slave i2c interface supported by an embedded hardware communication engine. the ST33TPM12I2C features hardware accelerators for advanced cryptographic functions. the edes peripheral provides a secure des (data encryption standard) algorithm implementation, while the nescrypt crypto-processor efficiently supports the public key algorithm. the ST33TPM12I2C operates in the 0 to +70c temperature and 3.3v supply voltage ranges. in order to meet environmental requirements, st offers these devices in different grades of ecopack? packages, depending on their level of environmental compliance. ecopack? specifications, grade definitions and device status are available at: www.st.com. ecopack? is an st trademark.
docid022806 rev 2 3/13 ST33TPM12I2C description figure 1. ST33TPM12I2C hardware block diagram 069 $+%$3%,qwhuqdo%xv 7kuhh elw wlphuv &5& 0rgxoh &orfn *hqhudwru 0rgxoh 7uxh 5dqgrp 1xpehu *hqhudwru 5$0 67520 %rrw vriwzduh 6hfxulw\ 0rqlwru lqjdqg &rqwuro ((3520 ('(6 $ffho hudwru 8vhu 520 67520 )luhzdoo $50? 6hfxu&ruh? 6&?&38 1(6 &5<37 0xowlsoh[hg,2v 5$0 &rgh'dwd 6ljqdwxuh 038 7,6(qjlqh 5$0 ,2%xiihu , &,qwhuidfh 73067% 6&/ 6'$ 730,54 5(6(7 33
pin and signal description ST33TPM12I2C 4/13 docid022806 rev 2 2 pin and signal description 2.1 pinout descriptions figure 2. tssop28 pinout figure 3. vqfn32 pinout 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 nc nc nc gnd nc nc pp sda scl vps gnd nc nc nc tpmstb tpmirq nc nc vps nc nc nc nc nc nc reset gnd nc tssop28 1 2 3 4 5 6 7 8 9 1011121314 28 27 26 25 24 23 22 21 20 19 18 17 16 15 gnd nc nc nc nc pp sda scl vps gnd nc nc nc tpmstb tpmirq nc nc vps nc nc nc nc nc nc reset gnd nc qfn32 29 30 31 32 nc nc nc nc nc
docid022806 rev 2 5/13 ST33TPM12I2C pin and signal description table 1. pin descriptions signal type description vps input 3.3v power supply . this pin must be connected to 3.3v dc power rail supplied by the motherboard. gnd input gnd has to be connected to the main motherboard ground. tpmstb input power down indicates that the peripheral should prepare for power to be removed from the interface devices. actual power removal is system dependent. reset input reset used to re-initialize the device pp input physical presence , active high, internal pull-down. used to indicate physical presence to the tpm. scl input i2c serial clock (open drain with no weak pull-up resistor) sda bidir i2c serial data (open drain with no weak pull-up resistor) tpmirq output tpm irq is used by tpm to handle interrupt support.
package mechanical data ST33TPM12I2C 6/13 docid022806 rev 2 3 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 3.1 28-pin thin shrink small outline package (tssop) with 4.4- mm body width dimensional features of the tssop28 package: body width 4.4 mm. pitch 0.65 mm. unless otherwise specified, general tolerance is 0.1 mm. figure 4. 28-lead thin shrink small outline package outline table 2. 28-lead thin shrink small outline package mechanical data symbol millimeters inches min. typ. max. min. typ. max. a 1.20 0.047 a1 0.05 0.15 0.002 0.006 a2 0.80 1.00 1.05 0.031 0.040 0.041 b 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.008 d 9.60 9.70 9.80 0.378 0.382 0.386 e 6.20 6.40 6.60 0.244 0.252 0.260 e1 4.30 4.40 4.50 0.170 0.173 0.177 <0b0( f / n $ ddd $ $ h e ' ( ( /
docid022806 rev 2 7/13 ST33TPM12I2C package mechanical data e 0.65 0.026 l 0.45 0.60 0.75 0.018 0.024 0.0230 l1 1.00 0.040 k0808 aaa 0.10 0.004 table 2. 28-lead thin shrink small outline package mechanical data (continued) symbol millimeters inches min. typ. max. min. typ. max.
package mechanical data ST33TPM12I2C 8/13 docid022806 rev 2 3.2 32-lead very thin fine pitch quad flat pack no-lead (vfqfpn) package figure 5. vfqfpn32 5x5 mm 0.5 mm pitch package outline table 3. vfqfpn32 5x5 mm package mechanical data symbol millimeters inches (1) min. typ. max. min. typ. max. a 0.800 0.900 1.000 0.0315 0.0354 0.0394 a1 0.000 0.020 0.050 0.0000 0.0008 0.0020 a3 0.200 0.0079 b 0.180 0.250 0.300 0.0071 0.0098 0.0118 d 4.850 5.000 5.150 0.1909 0.1969 0.2028 d2 3.500 3.600 3.700 0.1378 0.1417 0.1457 6hdwlqjsodqh ggg & & $ $ $ ' h 3lq,' 5 ( / / ' e ( b0( %rwwrpylhz
docid022806 rev 2 9/13 ST33TPM12I2C package mechanical data e 4.850 5.000 5.150 0.1909 0.1969 0.2028 e2 3.500 3.600 3.700 0.1378 0.1417 0.1457 e 0.500 0.0197 l 0.300 0.400 0.500 0.0118 0.0157 0.0197 ddd 0.050 0.0020 1. values in inches are converted from mm and rounded to 4 decimal digits. table 3. vfqfpn32 5x5 mm package mechanical data symbol millimeters inches (1) min. typ. max. min. typ. max.
delivery packing ST33TPM12I2C 10/13 docid022806 rev 2 4 delivery packing surface-mount packages can be supplied with tape and reel packing. the reels have a 13" typical diameter. reels are in plastic, either anti-static or conductive, with a black conductive cavity tape. the cover tape is transparent anti-static or conductive. the devices are positioned in the cavities with the identifying pin (normally pin ?1?) on the same side as the sprocket holes in the tape. the stmicroelectronics tape & reel specifications are compliant to the eia 481-a standard specification. figure 6. reel diagram table 4. packages on tape and reel package description tape width tape pitch reel diameter quantity per reel tssop 28 thin shrink small outline package 16 mm 8 mm 13 in. 2500 vfqfpn 32 very thin fine pitch quad flat pack no- lead package 12 mm 8 mm 13 in. 3000 table 5. reel dimensions reel size tape width a max. b min. c d min. g max. n min. t max. unit 13? 16 330 1.5 13 0.2 20.2 16.4 +2/?0 100 22.4 mm 12 12.6 18.4 !)$ ! $ " # . 4 '
docid022806 rev 2 11/13 ST33TPM12I2C delivery packing figure 7. embossed carrier tape for vfqfpn 5x5 mm 1. drawing is not to scale. figure 8. embossed carrier tape for tssop 16 mm 1. drawing is not to scale. $,9 7 % . ' ' < 3 3 < 3$ ( : ) 6hfwlrq<< 8vhugluhfwlrqriihhg table 6. carrier tape dimensions for vfqfpn 5x5 mm package a0 b0 k0 d1 min. p p2 d p0 e f w t max. unit fpn 5x5 5.25 0.1 5.25 0.1 1.1 0.1 1.5 8 0.1 2 0.1 1.55 0.05 4 0.1 1.75 0.1 5.5 0.1 12 0.3 0.3 0.05 mm $,9 : 7 . %r ' 3 3r % $r %r 3 ) ( ' 8vhugluhfwlrqriihhg .r 7r s &ryhu 7dsh table 7. carrier tape constant dimensions for tssop 16 mm tape tape size ao, bo, ko (1) d e po t max. unit 16 mm see note. 1.5 +0.1 / -0 1.75 0.1 4 0.1 0.4 mm 1. ao, bo, ko, are determined by components sizes. the clearance between the component and the cavity must be within 0.05 mm (min.) to 0.90 mm (max.)
revision history ST33TPM12I2C 12/13 docid022806 rev 2 revision history table 8. document revision history date revision changes 07-mar-2012 1 initial release. 07-nov-2013 2 updated logo information on page 2.
docid022806 rev 2 13/13 ST33TPM12I2C 13 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. a ll st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industr y domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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